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Industrial sensor (weld inspection, industrial CT, NDT). SNAP100x2 is a flexible solution for soft X-ray (<20 kVp for 0.75 mm CdTe) to hard X-ray (320+ kVp with 1.4 mm CdTe) imaging.
The larger width of the imaging area produces high quality images even in low flux applications and the dual channel design allows uninterrupted data capture.
The compact enclosure of the sensor is well suited for integration in applications requiring portability, such as pipe weld inspection.
Despite the compact size, the device is temperature controlled for maximum performance.
10 to 300 fps
Pixel depth @ 300 fps:
0.75 mm or 1.4 mm CdTe
2 columns of 4 hybrids each with 1.5 mm offset between columns
>70 % @ 2 lp/mm, >30 % @ 5 lp/mm
100 µm x 100 µm
width: 2 x 5.7 mm height: 98 mm
>80 % @ 0 lp/mm, >60 % @ 2 lp/mm, >20 % @ 5 lp/mm
+10 to +40 °C
-30 to +50 °C (max 2 days)
10 – 90 %
15 kV to 300 kV
+5 to +45 °C
Optoisolated I/O (5 V)
24 V, ≤ 12 W without temperature control
≤ 60 W with temperature control
Imaging application & software development kit
Windows 7 – 10 Pro 32-bit or 64-bit
The basic component in our detectors is a direct conversion material, which converts the X-rays into electrical signals, and a CMOS (ASIC) which transforms the electric signals into a data stream of either the integrated electric charge or the number of photons which has entered each pixel. This data is then used to create a digital image which is either two- or three-dimensional, depending on the scan geometry.Our Technology arrow_right_alt