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XC-Thor

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The XC-THOR series detectors are specifically designed for applications requiring solutions that are robust and radiation hard.

 

The direct conversion CdTe technology of these detectors bring the benefits of high sensitivity to industrial applications, along with the image sharpness intrinsic to photon counting. With dual energy capability, the XC-Thor additionally enables selective energy imaging, providing powerful removal of low energy scatter radiation. The superior radiation hardness of CdTe compared to scintillator detectors sets new standards in detector lifetime.

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check1000 fps at 100 micron resolution checkUnsurpassed levels of MTF and DQE checkUp to 300 kV, more with ultra-high kV options
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Performance & Sensor

Pixel technology

Photon counting

Pixel fill factor

100 %

Active sensor area

12.8 mm, 25.6 mm and 51.2 mm wide
80 mm to 400 mm length

Maximum frame rate

Up to 300 fps

DQE (0)

>75 % (RQA5 spectra, 6μGy, SID 1m)

Sensor material and thickness

Cadmium telluride (CdTe): 0.75 mm & 2.0 mm

Tile gap

100 μm

Count rate range

Up to 200 Mcps per mm2

Energy discrimination

Single / dual energy threshold

Lag

0 % (after X-ray 6μGy)

Pixel size

100 μm

X-ray energy rating

10 kVp to 300 kVp (higher energy solutions
available)

Imaging speed

Up to 10,000 lines/s

MTF

>75 % @ 2lp/mm, >45 % @ 5lp/mm

Ghosting

<0.1 % 1 min after X-rays (6μGy)

Data interface

GigE

Power supply

24 VDC

External trigger

Opto coupled 5 V, 12-24 V with external resistor

Operating temperature range

+5 to +35 °C

Storage relative humidity

10 % to 95 % humidity

Operating relative humidity

30 % to 85 %

Housing

IP67 rated
Designed to withstand 20G impacts

Storage temperature range

-20 to +50 °C

Software GUI included

Fully flexible SDK included

Supported operating systems

Windows 7 onwards

Technology

The basic component in our detectors is a direct conversion material, which converts the X-rays into electrical signals, and a CMOS (ASIC) which transforms the electric signals into a data stream of either the integrated electric charge or the number of photons which have entered each pixel. This data is then used to create a digital image which is either two- or three-dimensional, depending on the scan geometry.

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